Ajay Kumar Jha

Ajay Kumar Jha
Assistant Professor
QBB 258, A23
Department of Computer Science
North Dakota State University
Fargo, ND 58105, USA.
📧 ajay.jha.1@ndsu.edu



                          
The Software Testing And Maintenance (STAM) Lab

Team   🌴   Publication   🌴   Service   🌴   Teaching


Bio: I am an Assistant Professor at North Dakota State University. Prior to joining NDSU, I worked as a Postdoctoral Researcher for over two years at the University of Alberta and three years at Kyungpook National University. I earned both my Master’s degree (2013) and Ph.D. (2017) from Kyungpook National University under the supervision of Prof. Woo Jin Lee. Before pursuing graduate studies, I spent over five years in the software industry, where I co-founded two startups and served as a business development manager in two organizations. I have also served as a session chair, program committee member, and reviewer for prestigious conferences and journals, including MSR, FSE, ASE, SANER, ICSME, MobileSoft, ICSE, TSE, and EMSE. Further details are available in my CV (Updated Jan 12, 2025).

Research: I lead the Software Testing and Maintenance Lab, where our research focuses on developing innovative tools and techniques to improve the efficiency, effectiveness, and reliability of test suites. Please check the selected publications below or our full list of publications to know more about our research.

Understanding Test Deletion in Java Applications [Paper] [Dataset]
Suraj Bhatta, Frank Kendemah, Ajay Kumar Jha
In Proceedings of 22nd IEEE/ACM International Conference on Mining Software Repositories (MSR). 2025.

Migrating Unit Tests Across Java Applications [Paper] [Tool]
Ajay Kumar Jha, Sarah Nadi
In Proceedings of the 24th IEEE International Conference on Source Code Analysis and Manipulation (SCAM). pp. 131-142. 2024.

TRec: A Regression Test Recommender for Java Projects [Paper] [Tool]
Sai Kiran Bhrugumalla, Ajay Kumar Jha
In Proceedings of the 40th IEEE International Conference on Software Maintenance and Evolution (ICSME). pp. 903-907. 2024.